Fully/Semi Automatic Wafer Cleaning Machine

Machine Feature
- Programmable cleaning process (Cleaning time, drying time, table rpm, Cleaning arm speed)
- Able to control the wark's oreintation after finished cleaning and drying process.
Protection Function
- Incoming water flow rate check (min / max )
- Air pressure check to stop and give an alarm when incoming air pressure drop to the low limit.
ESD Specification
- Air Ionizer at cleaning area. Can turn on and off on screen.
- Anti Static Machine cover material.
Special Feature
- Special exhaust design to prevent partical scratch on work pieces.
- Main structure frame+cover.
- Automatic shutter door.
- Automatic ring frame lock.
- Spindle Unit (3000 rpm/min).
- Cleaning Arm Unit.
- Wafer Clamping set.
- Air System Unit.
- Water System Unit.
- Light Curtain Safety Devices.
- Ring frame checking sensor.
- SUS ring frame.
- Vaccuum sensor checker.
- Touch Panel Unit.
- Main Controller Unit.

Work piece dia.: max 12" in diameter.
Ring frame: N/A
Cleaning Method: Air Atomizing Nozzle
Cleaning Program: Able to program cleaning time, drying time, spindle rpm and nozzle speed.
Table rotation: Programable between 100-2000 rpm
Spinner table: SUS or aluminum type.
Operation panel: Touch panel
Machine dimension (approx): TBA

Waste no more time