Semiconductor Backend/Pack

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Launch of TEMA PI-CYLINDER: Print inspection on tubes, etc.
Launch of next super high speed Die Sorter
Launch of DS Variation ecoLINE
Introduction of new SIDEWALL inspection for DS15/20k and DS Variation
Entering the ultra-high-speed segment with the DS 20000
High speed flip chip technology DS 15000
Introducing the highly flexible DS Variation highLINE
High speed die sorting technology DS 6000/8000 and DS 10000
Growing experience in Carrier Tape machines & production
Start development of die bonder technology

Semiconductor Backend/Pack

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