Denka Tape

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Description
Specifications

Elegrip Tape (Dicing Tape)
Back Grinding Tape
Wafer Saw Tape
QFN Tape
Pre Tape
Post Tape
Characteristics
Excellent control to back-side chipping and chip fly-off
Excellent over-time stability (T Series)
Excellent adhesiveness (shape-following properties)
High performance to EMCs (Epoxy Mold Compounds) and other types of difficult-to-adhere work- pieces
Excellent expandability and smooth peeling

Specifications

Waste no more time

We work with many companies to manufacture our specialized equipment.
For questions, please contact us.